-Lead-Free / RoHS CompliantDescription Solder Paste in jar 250g (T3) SAC305 no clean 88.5% metal. Alloy: Sn96.5/Ag3.0/Cu0.5 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 88.5% metal by weight. Particle Size: T3 (25-45 microns..
-Lead-Free / RoHS CompliantDescription Solder Paste in jar 50g (T3) SAC305 no clean 88.5% metal. Alloy: Sn96.5/Ag3.0/Cu0.5 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 88.5% metal by weight. Particle Size: T3 (25-45 microns)..
-Solder Paste-Leaded-No Clean-SyringeSolder Paste no clean 63Sn/37Pb in 5cc syringe 15g w/plunger & tip.Metal Content: 88% metal by weight.Particle Size: T3 (25-45 microns)Size: 5cc/15g syringe..
-Package Weight : 0.11 pounds-Country of Origin : United States-Part number: SMD291SNL10-The paste is 96.5 percent tin, 3 percent silver, and 0.5 percent copperThis is lead-free, no-clean formula solder paste made specifically for leaded and lead-fre..