pasta de soldadura de colofonia activada bga crema de pasta fundente a base de colofonia de estaño para estación de retrabajo de soldadura placa de circuito pcb bga smd reparación de soldadura

TÉRMINOS Y CONDICIONES

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- El producto se trae a pedido, en un transcurso de 15 a 25 dias, si alguna restriccion de un ente gubernamental o de salud publica cambia o restringe vuelos, los pedidos pueden demorar mas tiempo.
- Precios pueden cambiar previo aviso. Depende de precio con proveedores o existencia.
- Fotos referenciales del producto, consulte no mas
- Despachamos a todo Chile con Starken.
- Productos importados de Estados Unidos, es probable que los productos electronicos trabajen en 110V y NO en 220V, podria usar un transformador, para mas informacion primero nos puedes preguntar todas las inquietudes que tengas.

-MECHANIC Advanced Paste Flux Soldering for mobile phone motherboard Repair, electric Soldering Iron Welding Fluxes for phone circuit board repair.
-Its boiling point only slightly higher than the melting point of the solder, For mobile phones, PC cards and other sophisticated electronic chip-level help welding.
-High bond strength, PH value neutral, insulation is strong, welding surface smooth, is no corrosive for IC and PCB.
-Wipe the surface of the object before soldering, apply the paste flux to the solder joint, solder the tin to the solder joint with soldering iron.
-Specifications: Model: MECHANIC-UV80; Color: Yellow, Weight: 0.08kg; Viscosity: 0.2Pas; Granularity: 0.22um; Packing: Aluminum box.

80g BGA Solder Flux Paste Solder Flux Paste High Synthetic Solder Flux Past for PCB ,BGA,SMD, PGA Repair Soldering Rework Station

Product Introduction:
?MECHANIC Advanced Paste Flux Soldering for mobile phone motherboard Repair
?High synthetic BGA Solder Flux Paste BGA Soldering Tin Cream
?Applicable to PCB, BGA, SMD, PGA repair soldering
?Solder paste welding fluxes for soldering station tin cream welding seal grease Tools
?Electric Soldering Iron Welding Fluxes for phone circuit board repair

Product Features:
?High bond strength, PH value neutral, insulation is strong, welding surface smooth
?It is no corrosivefor IC and PCB
?Its boiling point only slightly higher than the melting point of the solder
?For mobile phones, PC cards and other sophisticated electronic chip-level help welding

Optional Model:
?Option 1: MCN-UV50
?Option 2: MCN-UV80

Specifications:
?Model: MECHANIC-UV80
?Color: Yellow
?Weight: 0.08kg
?Viscosity: 0.2Pas
?Granularity: 0.22um
?Packing: Aluminum box

Notes:
?1.Wipe the surface of the object before soldering.
? 2.Apply the paste flux to the solder joint.
?3.Solder the tin to the solder joint with soldering iron.

Package List:
?1*MECHANIC Paste Flux