chip quik solder paste en frasco 250g sac305 no clean
- Marca:
chip quik
- Código producto: B07BS1MNQL
- Disponibilidad: Traemos a pedido, tiempo de 15 a 25 dias.
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$CLP 147.599
TÉRMINOS Y CONDICIONES
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- El producto se trae a pedido, en un transcurso de 15 a 25 dias, si alguna restriccion de un ente gubernamental o de salud publica cambia o restringe vuelos, los pedidos pueden demorar mas tiempo.- Precios pueden cambiar previo aviso. Depende de precio con proveedores o existencia.
- Fotos referenciales del producto, consulte no mas
- Despachamos a todo Chile con Starken.
- Productos importados de Estados Unidos, es probable que los productos electronicos trabajen en 110V y NO en 220V, podria usar un transformador, para mas informacion primero nos puedes preguntar todas las inquietudes que tengas.
-Lead-Free / RoHS Compliant
Description Solder Paste in jar 250g (T4) SAC305 no clean 88.5% metal. Alloy: Sn96.5/Ag3.0/Cu0.5 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 88.5% metal by weight. Particle Size: T4 (20-38 microns) Melting Point: 217-220C (423-428F) Size: 250g jar Shelf Life Refrigerated >6 months, unrefrigerated >2 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
Description Solder Paste in jar 250g (T4) SAC305 no clean 88.5% metal. Alloy: Sn96.5/Ag3.0/Cu0.5 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 88.5% metal by weight. Particle Size: T4 (20-38 microns) Melting Point: 217-220C (423-428F) Size: 250g jar Shelf Life Refrigerated >6 months, unrefrigerated >2 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
