cartucho de pasta de soldadura con plomo chip quik smooth flow sn63 / pb37 t4 500g
- Marca:
chip quik
- Código producto: B096BNBVLK
- Disponibilidad: Traemos a pedido, tiempo de 15 a 25 dias.
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$CLP 199.261
TÉRMINOS Y CONDICIONES
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- El producto se trae a pedido, en un transcurso de 15 a 25 dias, si alguna restriccion de un ente gubernamental o de salud publica cambia o restringe vuelos, los pedidos pueden demorar mas tiempo.- Precios pueden cambiar previo aviso. Depende de precio con proveedores o existencia.
- Fotos referenciales del producto, consulte no mas
- Despachamos a todo Chile con Starken.
- Productos importados de Estados Unidos, es probable que los productos electronicos trabajen en 110V y NO en 220V, podria usar un transformador, para mas informacion primero nos puedes preguntar todas las inquietudes que tengas.
-Solder Paste
Description Smooth FlowTM Technology Developed with a lower density flux vehicle for better shear spread and improved flow during heating Halogen Free (EN14582 test method) Specifications Alloy: Sn63/Pb37 Flux Type: Synthetic No-Clean Flux Classification: ROL0 Metal Content: 87.75% metal by weight. Particle Size: T4 (20-38 microns) Melting Point: 183C (361F) Size: 500g cartridge Shelf Life Refrigerated >12 months, unrefrigerated >6 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
Description Smooth FlowTM Technology Developed with a lower density flux vehicle for better shear spread and improved flow during heating Halogen Free (EN14582 test method) Specifications Alloy: Sn63/Pb37 Flux Type: Synthetic No-Clean Flux Classification: ROL0 Metal Content: 87.75% metal by weight. Particle Size: T4 (20-38 microns) Melting Point: 183C (361F) Size: 500g cartridge Shelf Life Refrigerated >12 months, unrefrigerated >6 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
